HMT microelectronic AG specializes in high-density modules combining ASICs, microcontrollers, EEPROMs, and power components using Chip-on-Board (COB) or Flip-Chip techniques. Their modules feature ultra-fine PCB technology with 40µm track and clearance, 5µm copper thickness, and filled microvias, offering high reliability, mechanical stability, and thermal conductivity suitable for automotive, industrial, and telecom applications . TDK Corporation offers the FS3303 micro POL power module, a 2.5 x 2.5 mm ultra-compact DC-DC converter delivering up to 3 A with peak efficiency around 95%. It supports input voltages from 2.7 V to 6 V and output voltages from 0.4 V to 3.3 V, leveraging 3D chip-embedded packaging for AI edge systems and optical modules . Infineon Technologies provides a broad portfolio of power modules, including IGBT, SiC MOSFET, thyristor, and diode modules. Their CIPOS™ intelligent power modules integrate multiple semiconductor devices for industrial, automotive, and renewable energy applications, offering high efficiency and reliability . Copley Controls supplies the Accelnet Micro Module series, compact digital servo control modules (64 x 41 x 16 mm) for high-density multi-axis installations. These modules support DC brush, brushless, linear, and voice coil motors with CANopen networking and flexible command interfaces, ideal for industrial and ruggedized applications . Vicor offers the Maxi, Mini, Micro DC-DC converter family, providing high power density, low noise, and advanced power processing. These modules support multiple input ranges, output voltages, and thermal management up to 100°C, with options for automated user-defined designs, enhancing flexibility and reducing lead times .
High-density micro-modules are widely used in:
When choosing a high-density micro-module supplier, consider:
Our portfolio offers scalable and innovative power module solutions to optimize energy management, simplify system design and
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These modules use the latest IGBT7 technology, engineered to reduce power losses by up to 15–20% compared to
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TTM Technologies is a manufacturer in HDI PCBs. TTM proposes microvia, microvia PCB, HDI boards, high density interconnect
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Microdul is specialized in manufacturing high-quality, miniature electronic modules and in the processing of uncased integrated circuits.
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FlexICs deliver high routing density with unmatched flexibility. Their multi-layer interconnects provide compact, high-speed signal
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Micro-Semiconductor is an industry leading electronic components distributor of Microcontrollers, Memory, Logic, Linear,
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Find the right power module for your application with Infineon''s wide range of solutions, designed for efficiency, reliability, and
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In offering both high density modules and full integration options, HMT can provide a complete solution with right split. Our
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High-Density-Module kaufen. Farnell Deutschland bietet eine schnelle Angebotserstellung, Versand am gleichen Werktag, eine
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TDK Corporation (TSE: 6762) today announced the FS3303, the first member of a major expansion of its micro POL
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