PCBs for AI optical interconnect modules require low-loss laminates (Dk < 3. 003 at 28 GHz), embedded thermal solutions (copper coin inserts for 10-15W per optical engine), ultra-tight impedance control (+/-5% at 56 GBaud lane rates), and precision fiducial. Engineering guide to PCB substrate requirements for co-packaged optics and optical transceiver modules in AI data center infrastructure. Covers low-loss laminate selection, thermal management for VCSEL/driver ICs, and 56 GBaud signal integrity. In the evolution of optical modules, PCBs predominantly adopt HDI structures—whether mechanical blind-via HDI, laser. Optical module PCB technology is evolving rapidly to meet the extreme demands of AI data centers and high‑speed networks. This article. Optical Module PCB refers to the printed circuit board (PCB) used within optical modules. It serves to mount components such as optoelectronic chips, driver circuits, and control chips, enabling high-speed signal transmission, electro-optical/optical-electrical conversion, and thermal management. Accompanying the rapid advancement of information technology, data transmission speeds and.
